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  • conga-mIQX COM-HPC Mini Qualcomm top
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  • Revolutionizing Edge AI: The conga-HPC/mIQ-X with Qualcomm

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conga-mIQX COM-HPC Mini Qualcomm top

conga-HPC/mIQ-X

Qualcomm® Dragonwing™ IQ-Xシリーズにより、初めて COM-HPC Mini にハイパフォーマンスARMを搭載

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          conga-HPC/mIQ-X

          Qualcomm® Dragonwing™ IQ-Xシリーズにより、初めて COM-HPC Mini にハイパフォーマンスARMを搭載

          COMについて学ぶ  - ガイドをダウンロード

          • 初めて COM-HPC Mini にハイパフォーマンスARMを搭載
          • 最大12個の Qualcomm® Oryon™ CPUコア
          • Qualcomm® Hexagon™ NPU（45 TOPS）
          • ハイパフォーマンス Qualcomm® Adreno™ GPU
          • PCI Express Gen 4 | USB 4
          • 産業用温度範囲：-40℃～+85℃
          • プレスリリース
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          Value adding ecosystem offerings

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          Specification

          Formfactor
          COM-HPC
          CPU
          Qualcomm® Dragonwing™ IQ-X7 (12 x 3.4 GHz, 6 MB cache, 45W)
          Qualcomm® Dragonwing™ IQ-X5 (8 x 3.4 GHz, 6 MB cache, 45W)
          DRAM
          Soldered down LPDDR5x memory from 16GB up to 64GB capacity | up to 8400 MT/s
          Ethernet
          2x 2.5 GbE via Qualcomm® QCA8081 Ethernet PHY transceiver | IEEE 1588v2 support | MACsec
          I/O Interfaces
          Up to 16x PCIe lanes (12x PCIe Gen4 + 4x PCIe Gen3)
          up to 2x USB4
          2x USB 3.1 Gen2 + 2x USB 3.0
          6 x USB 2.0
          2 x 4 lane CSI
          2 x UART
          12 x GPIO
          eSPI
          GPSPI
          2 x I²C
          CAN
          SM-Bus
          Mass storage
          UFS 4.0 SSD (optional) soldered down up to 1 TB capacity
          Graphics
          Qualcomm® Adreno GPU | Qualcomm® Spectra ISP
          NPU/AI Acceleration
          Qualcomm® Hexagon™ NPU with 45 TOPS
          congatec Board Controller
          Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
          embedded BIOS Features
          AMI Aptio® V UEFI firmware for ARM
          64Mbyte serial SPI with congatec Embedded BIOS feature
          OEM Logo
          OEM CMOS Defaults
          LCD Control
          Display Auto Detection
          Backlight Control
          Flash Update
          Security
          Trusted Platform Module (TPM 2.0)
          Power Management
          Embedded Controller | ACPI with battery support
          Operating Systems
          Ubuntu Pro Linux
          Microsoft® Windows 11 IoT Enterprise LTSC
          Yocto
          Temperature
          Operation -40°C to 85°C | Storage -40°C to 85°C
          Humidity
          Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
          Video Interfaces
          Up to 2x DDI (2x shared with USB4)
          eDP v1.4 | up to 8k (UHD) resolution
          Size
          95 x 70 mm

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet

          conga-HPC-mIQ-X.pdf Datasheet for conga-HPC/mIQ-X COM-HPC Mini module with Qualcomm Dragwonwing processor
          24.11.2025

          Whitepaper

          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Product Variants

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              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-HPC/mIQ-X7-64G UFS128 (P/N 053100)

              COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 64GB soldered down LPDDR5x memory | Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. 

              conga-HPC/mIQ-X7-32G UFS128 (P/N 053101)

              COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory | Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. 

              conga-HPC/mIQ-X7-16G UFS128 (P/N 053102)

              COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X7 with 12 Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory | Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. 

              conga-HPC/mIQ-X5-32G UFS128 (P/N 053106)

              COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8 Oryon CPU cores up to 3.4GHz | 32GB soldered down LPDDR5x memory | Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. 

              conga-HPC/mIQ-X5-16G UFS128 (P/N 053107)

              COM-HPC Mini module based on Qualcomm® Dragonwing IQ-X5 with 8 Oryon CPU cores up to 3.4GHz | 16GB soldered down LPDDR5x memory | Adreno GPU up to 1.25GHz | Hexagon NPU with 45 TOPS | Adreno DPU |Spectra ISP | 6MB system cache | 28-45W TDP | Industrial grade temperature range from -40°C to 85°C. 

              Ecosystem Details

              Cooling Solutions

              conga-HPC/mIQ-X-HSP-B (P/N 053154)

              Standard heatspreader for COM-HPC module conga-HPC/mIQX. All standoffs are with 2.7mm bore hole.

              conga-HPC/mIQ-X-HSP-T (P/N 053155)

              Standard heatspreader for COM-HPC module conga-HPC/mIQX. All standoffs are M2.5mm threaded.

              Carrierboards

              conga-HPC/EVAL-Mini (P/N 065640)

              Evaluation Carrier Board for COM-HPC Mini modules.

              conga-HPC/3.5-Mini (P/N 065630)

              COM-HPC Client 3.5” carrier board suitable for congatec COM-HPC Mini modules

              Module services

              Design-In Training (P/N 27000001)

              Design-Training to develop carrier boards for Computer on Modules