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conga-TC300

基于英特尔® 酷睿™ 处理器（第3代）Wildcat Lake 的 COM Express Type 6 紧凑型模块

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                conga-TC300

                基于英特尔® 酷睿™ 3系列处理 (Wildcat Lake）的COM Express Type 6 Compact 模块

                全面了解COM模块 - 立即下载指南

                • 英特尔® 高性能混合架构，支持多达6个CPU核心
                • 最新Xe3 GPU架构，配备XMX脉动阵列
                • 集成NPU 5.0 版本，最高可提供18 TOPS算力，专为低功耗AI推理设计
                • 可选配PCIe交换芯片，扩展更多PCIe通道
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                Value adding ecosystem offerings

                Virtualization

                Operating Systems

                IOT Software

                Cooling Solutions

                Carrierboards

                Module services

                Specification

                Formfactor
                COM Express Compact
                CPU
                Intel® Core™ 7 350 (2 P-cores, 4 LPE-cores, 4,8 GHz, 6MB Intel® Smart Cache)
                Intel® Core™ 5 320 (2 P-cores, 4 LPE-cores, 4,6 GHz, 6MB Intel® Smart Cache)
                Intel® Core™ 3 305 (2 P-cores, 4 LPE-cores, 4,3 GHz, 6MB Intel® Smart Cache)
                DRAM
                SO-DIMM socket for DDR5 memory modules up to 64 GB | up to 6400 MT/s
                Ethernet
                2.5 GbE via Intel® i226 Ethernet controller series | supporting TSN (only on selected product variants)
                I/O Interfaces
                4 x PCIe Gen4
                additional 4x PCIe Gen3 (optional via PCIe switch)
                up to 2x USB4 (dedicated BIOS required)
                4 x USB 3.2 Gen2 (includes USB 2.0)
                4 x USB 2.0
                2 x SATA
                2 x UART
                GPIOs
                GPSPI
                LPC or eSPI (optional)
                SMB
                I2C or I3C (optional)
                Mass storage
                UFS 3.1 (optional)
                Graphics
                Intel Xe 3 Graphics | Up to 18 TOPS Intel® XMX Matrix Engines
                NPU/AI Acceleration
                Integrated NPU 5.0 with up to 18 TOPS (only on selected product variants)
                congatec Board Controller
                Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
                embedded BIOS Features
                AMI Aptio® UEFI firmware
                64Mbyte serial SPI with congatec Embedded BIOS feature
                OEM Logo
                OEM CMOS Defaults
                LCD Control
                Display Auto Detection
                Backlight Control
                Flash Update
                Security
                Trusted Platform Module (TPM 2.0)
                Power Management
                ACPI 6.0 with battery support
                Operating Systems
                Microsoft® Windows 11 IoT Enterprise
                Microsoft® Windows 11
                Linux
                Ubuntu
                Hypervisor
                conga-zones Hypervisor
                Temperature
                Commercial Variants: Operation 0°C to 60°C | Storage -20°C to 80°C
                Humidity
                Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                Video Interfaces
                Up to 2x DDI (2x shared with USB4)
                LVDS or eDP
                Size
                95 x 95 mm (3,74" x 3,74")

                Documents

                All documents found on this page are updated without notification. Always check this page for the latest version.

                Data Sheet

                Datasheet for conga-TC300
                10.04.2026

                Whitepaper

                The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                Product Variants

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                    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                    conga-TC300/7-350 (P/N 053201)

                    COM Express Type 6 Compact module based on Intel® Core 7 350 processor with 2 P-cores and 4 LPE-cores | Integrated NPU | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 32 Execution Units | Single channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C | Intel code name Wildcat Lake

                    conga-TC300/5-320 (P/N 053202)

                    COM Express Type 6 Compact module based on Intel® Core 5 320 processor with 2 P-cores and 4 LPE-cores | Integrated NPU | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 32 Execution Units | Single channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C |  Intel code name Wildcat Lake

                    conga-TC300/3-305 (P/N 053203)

                    COM Express Type 6 Compact module based on Intel® Core 3 305 processor with 2 P-cores and 4 LPE-cores | 6MB Intel® Smart Cache (L3) | Intel® Graphics with 16 Execution Units | Single channel SODIMM DDR5 memory interface with up to 6400 MT/s and up to 64 GB memory capacity | Commercial grade temperature range from 0°C to 60°C | Intel code name Wildcat Lake

                    Ecosystem Details

                    Virtualization

                    conga-zones Hypervisor (P/N 300501)

                    Operating Systems

                    ctrlX OS (P/N 300020 )
                    Ubuntu Pro (P/N N/A)
                    Kontron OS (P/N 300004)

                    IOT Software

                    Application Manager (P/N 300201)
                    COM Manager (P/N 300200)
                    Fleet Manager (P/N 300202)
                    Cloud Connector (P/N 300203)

                    Cooling Solutions

                    conga-TC300/CSA-HP-B (P/N 052350)

                    Standard active cooling solution for COM Express module conga-TC300. All standoffs are with 2.7mm bore hole.

                    conga-TC300/CSA-HP-T (P/N 052351)

                    Standard active cooling solution for high performance COM Express module conga-TC300. All standoffs are M2.5mm threaded.

                    conga-TC300/CSP-HP-B (P/N 052352)

                    Standard passive cooling solution for COM Express module conga-TC300. All standoffs are with 2.7mm bore hole.

                    conga-TC300/CSP-HP-T (P/N 052353)

                    Standard passive cooling solution for COM Express module conga-TC300. All standoffs are M2.5mm threaded.

                    conga-TC300/HSP-HP-B (P/N 052354)

                    Standard heatspreader for COM Express module conga-TC300. All standoffs are with 2.7mm bore hole.

                    conga-TC300/HSP-HP-T (P/N 052355)

                    Standard heatspreader for COM Express module conga-TC300. All standoffs are M2.5mm threaded.

                    Carrierboards

                    conga TEVAL/ COMe 3.1 (P/N 065820)

                    Evaluation carrier board for COM Express Type 6 revision 3.1 modules.

                    Module services

                    Design-In Training (P/N 27000001)

                    Design-Training to develop carrier boards for Computer on Modules

                    Conformal Coating COM Express Basic and Compact (P/N )

                    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
                    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.

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